Processor Design

• Blocking and power supply concepts for
  hi-speed applications
• EMC-compliant Power and Ground design
• Connection and shielding of hi-speed signals
  (Differential-pairs, Ethernet, Flexray, LVDS, MII, and others)
  
  

Hi-Speed Modules

• Connection of hi-speed memory chips (DRAM)
  with compliance to impedance and length requirements
  
  

Power stage and High-current modules

• EMC-compliant placement and shielding
• Reduction of electrical fields (radiation)

Analog modules

• EMC-compliant Power and Ground concepts
• Star-point design, ground-focused design,
  ground-focused placement of block capacitors
  
  

EMC in general

• Placement of modules in compliance with EMC requirements
  (analog, digital, Power and Hi-speed)
• Reduction of radiation and interference (interference immunity)
• Local Ground for modules, Star-point design
• Signal routing, shielding and decoupling strategies
• Impedance control
  
  

Technologies

• HDI-technology (Blind and buried vias)